H2020-MASSTART Project has proudly contributed to the Photonics Days Berlin Brandenburg 2020 organized by OpTecBB with a dedicated Conference Session on Data Center Interconnects – Towards Mass Manufacturing, Tue., 6th October 2020, chaired by Benjamin Wohlfeil (ADVA) & Paraskevas Bakopoulos (Mellanox Technologies / NVIDIA).


Automated assembly solutions as key for mass manufacturing of high-speed photonic transceivers [slides] [talk]
Moritz Seyfried, ficonTEC Service GmbH, Germany

PICs for data center interconnects [slides] [talk]
Benjamin Wohlfeil, ADVA Optical Networking SE, Germany

High-speed optical interconnects for intra- and inter-DC applications [slides] [talk]
Stelios Pitris, Aristotle University of Thessaloniki, Greece

Towards mass manufacturable Terabit transceivers for the datacentre [slides] [talk]
Elad Mentovich, Mellanox / NVIDIA Networking, Israel

High throughput validation for 400G/800G optical transceivers [slides] [talk]
Ali Emsia, Tektronix GmbH, Germany

Advances in optical packaging for the design of datacenter transceivers [slides] [talk]
Kobi Hasharoni, DustPhotonics Ltd, Israel

Advances in Silicon Photonics targeting next generation transceiver PICs [slides] [talk]
Stéphane Bernabé, CEA-Leti, France

TSV integration into silicon photonics interposer for next generation transceiver PICs [slides] [talk]
Bogdan Sirbu & Kai Zoschke, Fraunhofer IZM, Germany

ioNext, a glass-based platform complementing Silicon Photonics [slides] [talk]
Adrien Billat, Teem Photonics SA, France

Design and realization of high-power DFB lasers based on Al-free MQW for new generation of transceivers PICS [slides] [talk]
Sofiane Belahsene, Almae Technologies, France

Develop your custom Photonic Integrated Circuit for Data Centers [slides] [talk]
Katarzyna Ławniczuk, Bright Photonics BV, Netherlands